/Department of Mechanical Engineering
Computational Modeling, Analysis, and Design Optimization Lab

Lingfeng Gao

Lingfeng Gao

Lingfeng Gao

Ph.D. Student (2022.01-present)

Research area:

  • Topology optimization of non-linear, electromagnetic system.

Contact:

E-mail: lingfeng.gao{at}stonybrook.edu

 

Journal publications:

  1. Lingfeng Gao, Xiaoping Zhu, Masato Tanaka, Yuyang Song, Yuqing Zhou, Xianfeng David Gu, Shikui Chen*, “Geometry-Driven Design of Morphable Surface Structures Using Topology Optimization and Circle Packing”,Journal of Mechanical Design.
  2. Lingfeng Gao, David Torrey, Fang Luo, Jon Longtin, Shikui Chen*. "Multi-Material Topology and Magnetization Co-Optimization of Circular Halbach Arrays Via a Cardinal Basis Function-Based Level Set Method." Journal of Mechanical Design, September 2026; 148(9): 091705. https://doi.org/10.1115/1.4071075
  3. Jiawei Tian,Lingfeng Gao, David Torrey, Fang Luo, Jon Longtin, Shikui Chen*. “Nonlinear Multi-Physics and Multi-Objective Topology Optimization of Synchronous Reluctance Motors Using a CBF-Based Level-Set method.”, Engineering with Computers. (Under review)

 

Conference publications:

  1. Gao, L., Guo, Z., Chen, Y., Sethuraman, L., Renedo, J., Paranthaman, P., and Chen, S*. “Nonlinear and Multi-material Topology Optimization of a 22-Mw Generator For Power Efficiency Maximization” ASME IDETC/CIE 2026, Houston, Texas, USA, August 23–26,2026.
  2. Lingfeng Gao, David Torrey, Jon Longtin, Fang Luo, Shikui Chen*, “Shape and Topology Optimization of Circular Halbach Array Using a Cardinal Basis Function (CBF) Based Parametric Level Set Method”, the ASME 2025 International Design Engineering Technical Conferences &  Computers and Information in Engineering Conference (IDETC/CIE 2025), August 17-20, 2025, Anaheim, CA, USA.
  3. Lingfeng Gao, Xiaoping Zhu, Masato Tanaka, Yuyang Song, Yuqing Zhou, Xianfeng David Gu, Shikui Chen*, “Geometry-Driven Design of Morphable Surface Structures Using Topology Optimization and Circle Packing”, the ASME 2024 International Design Engineering Technical Conferences &  Computers and Information in Engineering Conference (IDETC/CIE 2024), August 25-28, 2024, Washington, DC, USA.
  4. Xiaoqiang Xu, Abdul Basit Mirza,Lingfeng Gao, Fang Luo, Shikui Chen*. “ Topology Optimization of Heat Sink for 3D Integrated Power Converters.” ASME Proceedings of InterPACK, October 25-27, 2022, Garden Grove, California, USA.

 

Patents:

  1. Systems and methods for forming multiple 3d structures from a circularly-packed network of structural elements.U.S. Patent number 12,467,274.
  2. Surface morphing technology using an interconnected network of circular compliant actuators.U.S. Patent number 20260044130A1.